I just got everything setup tonight, all the dies are functioning as they should, but there seems to be some difficulty when the case is in the FL sizer. Takes extra umpfh, even more than what I'm use to.
Am I missing something?
The die is touching the shellplate when the ram is fully up, and the decapping pin is at the prescribed length.
Thanks for the help.
Am I missing something?
The die is touching the shellplate when the ram is fully up, and the decapping pin is at the prescribed length.
Thanks for the help.